The current infrared imaging systems can be divided into two categories: optical ratio machine scanning type and non-scanning type. The infrared imaging system is of the optical-mechanical scanning type. With the help of the optical-mechanical scanner, the unit detector scans each part of the scene in turn to form a two-dimensional image of the scene. In the optical-mechanical scanning infrared imaging system, the detector converts the received radiation signal into an electrical signal, and the background radiation can be eliminated from the target signal through a DC blocking circuit, thereby obtaining an infrared image with good contrast. Therefore, although this type of infrared imaging system has the disadvantages of complex structure and high cost, it still attracts attention, and has made great progress and is becoming more and more perfect.

The non-scanning infrared imaging system uses a multi-element detector array, so that each unit in the detector corresponds to a micro-surface element of the scene, so the opto-mechanical scanning can be eliminated. Staring infrared imaging systems fall into this category. In recent years, silicide Schottky barrier focal plane array technology has made great progress. Using the process technology of silicon VLSI technology, high uniform responsivity and high resolution detector area array can be obtained, which greatly promotes non-scanning The rapid development and practical application of infrared imaging technology. The pyroelectric infrared imaging system also belongs to the non-scanning infrared imaging system. The pyroelectric material is used as the target surface to make the pyroelectric camera tube, and the electron beam scanning and the corresponding processing circuit are directly used to form a TV camera type thermal imager, which completely cancels the optical-mechanical scanning, thereby simplifying the structure and reducing the Refrigeration is required and costs are reduced, but the performance is not as good as that of optomechanical scanning infrared imaging systems.

The whole system includes four components: optical system, infrared detector and refrigerator, electronic signal processing system and display system.